Many technical challenges remain for the improved long-term safety of implantation surgery and the biostability of prosthetic devices. Device miniaturization is one of the key priorities. The initial version of the epiretinal prosthesis, Argus I, is interfaced with a 16-platinum-electrode array embedded in a silicone rubber platform.
18 Its intraocular components include an electrode array less than 1-mm thick and, extending from it, a 600-μm diameter cable that might be too bulky for intraocular implantation.
19 Meanwhile, the initial subretinal prosthesis version, Alpha IMS, consisted of a silicon-based microphotodiode array chip embedded between polyimide layers of approximately 70-μm thickness. The current version of the epiretinal implant, Argus II, with its flexible polyimide-based microelectrode array,
20 is thinner than the previous version. Presently, a parylene-based electrode array for better hermetic sealing is under investigation.
21 Traditionally, hermetic enclosures packaging electronics are formed of titanium (Argus II) or ceramic (Argus I and Alpha IMS) and are joined to a feedthrough to deliver electrical signals to the electrode array.
22 Feedthrough technologies, however, with their increasing number of stimulation channels, hinder the device miniaturization that is essential to the development of high-density electrode arrays. Our group offers outstanding prosthetic device miniaturization relative to the leading groups. We successfully manufactured a monolithically encapsulated LCP-based retinal prosthesis that does not require any feedthrough and that, accordingly, allows for further miniaturization comparable to the Ahmed Glaucoma Valve. Additionally, we realized a further reduction of electrode array thickness, to 30 μm, by means of an advanced fabrication process such as laser-machining.
13 Furthermore, the long-term reliability of our device, achieved through adequate hermetic sealing, has already been established in a previous report.
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